Entry Information

PART 1: PERSONAL PARTICULARS

Name

Wenwen Liu

Title

Ms

Gender

Female

Recent Photo

Recent Photo

Date of Birth

31/08/1997

Place of Birth

China

Type of Identity Document Held

Hong Kong Identity Card

HKID / Passport Number

26156

Nationality

Chinese

PART 2: CONTACT INFORMATION

Email Address

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Contact Phone Number

+85253357721

Address

328, Haking Wong Building, Pokfulam Road
Hong Kong
Hong Kong

PART 3: FORUM INTEREST

First Discipline to be Joined

Life Science and Medicine

Second Discipline to be Joined

Mathematical Sciences

Statement of Purpose to Join the Forum (max. 200 words)

Participating in this forum will provide me with invaluable opportunities to learn from leading experts and share insights with fellow participants. I believe that exposure to diverse perspectives will enhance my knowledge and inspire innovative ideas in my field. Additionally, building a strong network with researchers and professionals will facilitate future collaborations and contribute to my growth as a scientist. I am committed to actively participating and contributing to discussions, making the most of this opportunity to advance my academic and professional journey.

PART 4: ACADEMIC AND/OR RESEARCH INFORMATION

Academic Level / Position

PhD Graduate

Academic Subject / Research Field

Mechanical Engineering

Current Affiliated University / Institution / Organisation

The University of Hong Kong

Location

Hong Kong

Resume

Resume

Transcript 1

Transcript 1

First Academic or Research Referee *

First Referee Name

Research Assistant Professor, Dr. Changjin WU

First Referee University

The University of Hong Kong

First Referee Position

Research Assistant Professor

First Referee Email Address

Email hidden; Javascript is required.

Second Academic or Research Referee

Would you like to present your Research in Poster Presentation Session and/or Flash Presentation?

Both Sessions

PART 5: OTHERS

Did you participate in the inaugural Hong Kong Laureate Forum?

Yes, as a Young Scientist

How Did You Know About the Forum?

Our email